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KTC to Participate in Advanced Semiconductor Packaging & Chiplet Show 2026
Date 2026-08-26 Views166

The Korean Testing Certification Institute will participate in Advanced Semiconductor Packaging & Chiplet Show 2026, also known as ASPS 2026, one of Korea’s leading exhibitions specializing in advanced semiconductor packaging and chiplet technologies.


The exhibition will be held at the Suwon Convention Center from August 26 to 28.


Jointly hosted by Gyeonggi Province and Suwon City, the event will bring together approximately 180 Korean and international companies to share the latest technologies and industry trends in advanced packaging, chiplets, semiconductor materials and processes, inspection and testing equipment, and thermal management solutions.


The Korean Testing Certification Institute will operate an exhibition booth showcasing its reliability testing and evaluation capabilities for AI, future mobility, and advanced packaging semiconductors.

The Institute will also introduce its One-Stop business support strategy covering each stage of the semiconductor value chain.


Other featured initiatives will include the establishment of the Future Vehicle Electronic Component and System Semiconductor Reliability Verification Center in Wonju, the Institute’s 13 strategic management areas, its semiconductor collaboration strategy, and its nationwide network of regional business support centers.


The rapid growth of generative AI, autonomous driving, high-performance computing, and data centers is increasing the importance of AI semiconductors, high-bandwidth memory, and chiplet-based advanced packaging technologies.


As a result, demand is growing for reliability testing that comprehensively evaluates the thermal, mechanical, and electrical characteristics of highly integrated, high-performance semiconductors.

In response to these industrial changes, the Korean Testing Certification Institute is continuously strengthening its reliability testing and evaluation capabilities for AI, automotive, and advanced packaging semiconductors.


It is also establishing a One-Stop testing and certification system covering the entire semiconductor value chain, from materials and packages to modules, systems, and finished products.


The Korean Testing Certification Institute serves as the lead organization for the Ministry of Trade, Industry and Energy’s KRW 33 billion project to establish the Future Vehicle Electronic Component and System Semiconductor Reliability Verification Center.


By 2027, the Institute plans to build the reliability verification center in Wonju, Gangwon State, and install 26 types of advanced testing equipment.

The center is expected to provide companies with comprehensive performance and reliability evaluation services for advanced semiconductors.

Through the exhibition, the Institute will expand cooperation with semiconductor companies and related organizations.


It will also support the technological competitiveness and global market entry of Korean semiconductor companies through customized testing and evaluation, technical consulting, and discussions on international standards development.


President Sung-il Ahn of the Korean Testing Certification Institute stated that the growth of the AI and future mobility industries is making objective testing and certification of high-performance semiconductor quality and reliability increasingly important.


He added that the Institute would actively promote its semiconductor testing and certification capabilities and business support services while supporting the technological development and global competitiveness of Korean semiconductor companies.